System-on-Сhip (SoC)
Irtysh A68SV
The Irtysh A68SV is a highly integrated Russian processor related to System-on-Chip (SoC) designed for building modern embedded devices, Internet of Things (IoT) systems, and industrial electronics. The processor combines computational cores, a graphics controller, and an extensive set of peripheral interfaces on a single chip, providing high performance with minimal power consumption and area of the board.
Key advantages:
- High level of integration: built‑in/embedded graphics and video processing modules, and memory controllers (DDR) reduce the number of external components, lowering costs and simplifying development of end products.
- Energy efficiency: an optimized architecture and low Thermal Design Power (TDP) make the chip an ideal solution for autonomous devices, Edge-computing, and systems with tight power restrictions.
- Complete software ecosystem: full compatibility with leading Russian real‑time and general‑purpose operating systems (Alt Linux, Rosa). Confirmed by compatibility certificates.
Application areas – industrial automation, IoT gateways and controllers, data collection terminals, multimedia information panels, secure communications devices, and transport electronics.
| Category | Characteristic |
| Clock frequency | Up to 2.2 GHz |
| Number of cores | 8 physical cores |
| Processor core | 64-bit superscalar core (3 instructions per cycle) — LA364E; LoongArch® ISA support; Out-of-order execution. |
| Cache memory | L1: 64 KB instruction cache + 64 KB data cache per core (private); L2: 6 MB of shared cache (shared across all cores). |
| Integrated GPU | LG200 - general-purpose integrated graphics processor: • 4×MSAA support; • Memory compression; • Dynamic power management; |
| Integrated VPU | Hardware video accelerator • Decoding: HEVC / H.264 / VP8 / VP7 / AV1 / MPEG-4 / JPEG; • Encoding: HEVC / H.264 / JPEG. |
| Memory interface | 64-bit DDR4-3200 interface (up to 32 GB) Or 2×32-bit LPDDR4-3200 interfaces (up to 16 GB); DDR4 x8/x16 chips supported; x4 chips not supported. |
| PCIe / RapidIO | PCIe 0: 4 lanes, configurable as 1×4 / 4×1, PCIe 3.0; PCIe 1: 4 lanes, configurable as 1×4 / 2×1, PCIe 3.0; Each port can be reconfigured to RapidIO 2.2 (x4/x2/x1, up to 5.0 Gbit/s). |
| Video interfaces | Supports up to three simultaneous displays, including two independent: • HDMI 2.0 (up to 4K@60 Hz); • DisplayPort 1.4 (up to 4K@60 Hz); • eDP 1.4 (up to 4K@60 Hz); • Hardware cursor support: 64×64 / 32×32 pixels. |
| Network interfaces | 2× 1 gigabit GMAC controllers with RGMII interface: • IEEE 802.3 support, full/half-duplex modes; • TSN (Time-Sensitive Networking) support; • IEEE 802.1Qbv, IEEE 802.1Qav; • Hardware timestamping, IEEE 1588/802.1AS support. |
| USB | 4× USB 3.1 Gen1 (5 Gbps); 8× USB 2.0 (4 ports shared with USB 3.1 ports); Compliant with xHCI Rev. 1.1 protocol. |
| Storage | 1× SATA 3.0 (6 Gbps, compliant with AHCI 1.1/1.3.1); 1× eMMC 5.1 (8-bit mode); 2× SDIO 3.0 (1-/4-bit modes). |
| Audio interfaces | HDA (High Definition Audio): 7.1-channel output, up to 192 kHz, 20-bit resolution I2S: 16/22.05/32/44.1/48 kHz support, master/slave modes, DMA |
| Other interfaces | 8× UART (compliant with NS16550A, 2 of which support 4-wire mode); 4× I2C (SMBus support); 2× SPI (SPI0 supports system boot); 1× LPC 1.1 (for connecting TPM and Super I/O devices); 4× CAN-FD; 4× PWM (32-bit timers); Up to 58 GPIO (4 dedicated + 54 multiplexed); 1× AVS (Adaptive Voltage Scaling). |
| Encryption module | Not available |
| Power management | Full ACPI 4.0a support: • S0, S3 (suspend to RAM), S4 (hibernation), S5 (full shutdown) states; • Wake-up support via USB, GMAC, and power button; • Dynamic voltage and frequency scaling (DVFS) for CPU and iGPU. |
| Package type | FC-BGA-951 (Flip-Chip Ball Grid Array); Size: 21 mm × 21 mm, solder ball material: SAC305. |
| Operating temperature | Standard: –20°C ... +70°C (package temperature); Industrial version: –40°C ... +85°C (package temperature). |
| Thermal characteristics | Idle mode (desktop): ~5.5 W; Office applications: ~10.9 W; 4K video playbac[k (H.264): ~10.4 W; Maximum load: up to 35 W (at 2.2 GHz / 800 MHz iGPU); S3 (suspend to RAM): 0.382 W. |
| Features | • Integrated temperature sensor (accessible via I2C); • RTC with 32.768 kHz crystal and three interrupt timers; • HPET (High Precision Event Timer); • Watchdog timer (up to 82 s). |